A single, non-conductive substrate with a single conductive layer of metal foil, most often copper, laminated to one side.
All electronic components are placed on one side, and the conductive circuits (traces) are etched on the other side.
A solder mask is applied to protect the copper from oxidation and short circuits, and a silkscreen layer is often added for component labeling.
Circuits can only be laid out on one side, so conductive paths cannot overlap. This limits space and makes them less suitable for complex, high-density designs.
Due to the single layer, these boards are more susceptible to electromagnetic interference (EMI) and crosstalk compared to multi-layer boards, especially in sensitive applications.